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OXYGEN FREE HIGH CONDUTIVITY COPPER (OFHC)

Oxygen free high conductivity copper is produced by the direct conversion of selected refined cathodes under carefully controlled conditions to prevent any contamination of the pure oxygen-free metal during processing.

The process used to manufacture OFHC (Oxygen-Free High Conductivity) copper guarantees an exceptionally high-grade metal, boasting an impressive copper content of 99.996%. With such minimal presence of foreign elements, this copper variant brings out the inherent qualities of pure copper to a remarkable extent. These characteristics encompass remarkable ductility, exceptional electrical and thermal conductivity, substantial impact resistance, favorable creep resistance, ease of welding, and minimal volatility even under high vacuum conditions. OFHC copper contains less than 10 parts per million of oxygen within the metal, ensuring it is entirely devoid of copper oxide particles.

Lower oxygen content in oxygen free high conductivity copper has many advantages over ETP copper as shown in the following table.

ELECTROLYTIC TOUGH PITCH COPPER

Chemical Composition
Material Normal Composition Nearest Relevant Composition Specification
BS: 2870 ISO JIS
Electrolytic Tough Pitch
H.C. Copper
Cu - 99.90% Min. C 101 Cu ETP
1337		 H 3100
C 1100
Pb - 0.005% Max
Bi - 0.001% Max
O2 - 0.060% Max

TYPICAL MECHANICAL PROPERTIES

Material Temper Tensile Strength N/mm2 Elongation % on 50 mm G.L. Vickers Hardness VPN ISO JIS
Electrolytic Tough Pitch H.C. Copper ‘O 210 Min 35 Min 55 Max Cu ETP
1337		 H 3100
C 1100
M 210 Min 35 Min 65 Max
1/2 H 240 Min 10 Min 70 to 95
H 290 Min - 90 Min
‘O’b : Annealed Condition
1/2 Hv : Half Hard
Hb : Hard
* : Electric Conductivity at 20 Deg. Cel.100% IACS (For Cu ETP ‘O’ Temper)

DEOXIDIZED PHOSPHOROUS COPPER

Chemical Composition
Material Normal Composition Nearest Relevant Composition Specification
BS: 2870 ISO JIS
Phosphorous Deoxidized Copper (DONA) Cu - 99.85% Min
P - 0.013-0.050%		 C 106 Cu DHP 1337 H 3100
C 1220
Material confirming to other National Specification e.g. ASTM, DIN etc. is also provided.
Available in Strips, Sheets, Plates & Circles form.
TYPICAL MECHANICAL PROPERTIES
Material Temper Tensile Strength N/mm2 Elongation % on 50 mm G.L. Vickers Hardness VPN ISO JIS
Phosphorous Deoxidized Copper ‘O’ 210 Min 35 Min 55 Max Cu DHP 1337 H 3100
C 1220
M 210 Min 35 Min 65 Max
1/2 H 240 Min 10 Min 70 to 95
H 290 Min - 90 Min
‘O’b : Annealed Condition
1/2 Hv : Half Hard
Hb : Hard

PHOSPHORIZED LOW RESIDUAL PHOSPHORUS COPPER

CHEMICAL COMPOSITION
Material Normal Composition Nearest Relevant Composition Specification
IS ASTM EN
Phosphorized Low Residual Phosphorous Copper Cu - 99.90% Min.
P - 0.004 - 0.012 		IS :1545 : 1994 B75
C12000 / Cu-DLP 		N
TYPICAL MECHANICAL PROPERTIES
Material Temper Tensile Strength N/mm2 Elongation % on 50 mm G.L. Vickers Hardness VPN Conductivity % IACS ISO ASTM
Phosphorized Low Residual Phosphorous Copper ‘O’ 205 Min 40% Min 60 Max 90 % Min IS : 1545 : 1994 B 75 C 12000/Cu-DLP
Hb 245 - 325 - 80 - 100 88 % Min
HD 315 Min - 105 Min
‘O’ : Soft - Annealed Condition
Hb : Half Hard Condition
HD : Hard Condition
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CADMIUM COPPER

Pure unalloyed copper is soft and ductile, and usually contains approximately 0.7% impurities. Cadmium copper alloys are considered high copper alloys, they contain approximately 98 - 99 % copper, 0.1 - 1.5% cadmium and sometimes minor amounts of other materials. When cadmium is added to copper the material becomes more resistant to softening at elevated temperatures. The more cadmium that is added the more heat resistant the material becomes. Small additions of cadmium do not affect the thermal and electrical conductivities, and room temperature mechanical properties of cadmium copper.

CADMIUM COPPER APPLICATIONS

  • Trolley wire
  • Heating pads
  • Electric blanket elements
  • Spring contacts
  • Connectors
  • High strength transmission lines

It is also used for soldering applications, particularly to join components in automobile and truck radiators and semi conductor packaging operations. The UNS alloy designations for cadmium copper alloys containing approximately 1% cadmium are C16200 and C16500. An alloy containing 0.1 to 0.2% cadmium is designated as C14300. There are no cast cadmium copper alloys. The microstructure of the cadmium copper is similar to the pure copper materials. Cadmium copper is easily cold work and hot formed. Microstructures of the worked materials would contain equiaxed, twinned grains. The structures may contain oxide inclusions throughout the grains.

About

New India Group has production plants located at Silvassa and Umbergaon, spread over area of over 60000 square metres and with a covered area of 25000 square metres where electrolytic copper products like copper tubes, bus bars, rods, foils, profiles and components are produced.

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